Aluminum PCB plate production specifications
Aluminum substrates are often used in power devices, and the power density is large, so the copper foil is relatively thick. If a copper foil of 3 oz or more is used, the etching process of the thick copper foil requires engineering line width compensation, otherwise, the line width after etching will be excessive.
2. The aluminum base of the aluminum substrate must be protected with a protective film in advance during the PCB processing. Otherwise, some chemicals will erode the aluminum base surface, resulting in damage to the appearance. Moreover, the protective film is easily scratched, causing a gap, which requires that the entire PCB processing process must be inserted.
3. The milling cutter used for the glass fiberboard raft is relatively hard, and the milling cutter used for the aluminum substrate has a high hardness. The production of glass fiberboard milling cutters during processing is fast, while the production of aluminum substrates is at least two-thirds slower.
4.Computer milling edge fiberglass board is only using the machine's own cooling system to dissipate heat, but the processing of aluminum substrates must be additional heat for the hoe and alcohol.
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